82.3 F
New York
Tuesday, July 9, 2024
HomeAIU.S. Plans Up to $1.6 Billion in Funding for Packaging Computer Chips

U.S. Plans Up to $1.6 Billion in Funding for Packaging Computer Chips

Date:

Related stories

U.S. and allies take down Russian ‘bot farm’ powered by AI

The effort drove nearly a thousand covert accounts on X....

Why the French election result was such a surprise

Polling firms say their models weren’t able to fully...

GenAI Makes Project Managers More Productive, Collaborative, Creative and Effective, finds new research from PMI

GenAI Makes Project Managers More Productive, Collaborative, Creative and...

FTC Bars Messaging App NGL From Serving Users Under Age 18

The move against the app NGL by the Federal...

The proposed funding, part of the CHIPS Act, is intended to stoke chip packaging, a process that helps drive progress in semiconductors but that takes place mostly in Asia.

News

LEAVE A REPLY

Please enter your comment!
Please enter your name here